G&N offers the complete spectrum of vertical surface grinding machines for machining of conventional
metal as well as brittle electronic and other difficult-to-machine materials including ceramics
and silicon for various high-tech applications: from the small manually operated table machine up to
the fully automatic 300 mm wafer grinding system as well as machines capable of chucking Ø 700 mm parts.
In addition, G&N supplies automatic inner diameter (ID) saws for slicing semiconductor-material
up to Ø 200 mm, also available as GS (combined grinding / slicing) version.
JSP Technology, Inc.