Grinding Machine MPS 3-134 single mode
Characteristics
Super finishing of mono + poly-crystalline silicon blocks for solar wafer
High precision flat grinding machine with oscillating table and two spindles.
Prepared for robot-loading of block
Main grinding spindle with combi -wheel D46/D15
Second grinding spindle for simultaneously chamfering the edges of the block.
chamferring of the edges and grinding of the faces in the same clamping
position (no rechucking)
Automatic handling (loading, unloading, turning) of the block.
Automatic grinding process
Models
MPS 3-134 Twin with TwinSpindle
MPS 3-134 Extended with max. block lenght of 550mm
JSP Technology, Inc.