The machine with fully enclosed grinding area,
increased power efficiency and digital control concept.
Characteristics
The MPS R400 DS line of machines have been designed to take advantage of
state-of-the-art grinding technologies and ergonomics. The fully
encapsulated grinding area offers optimum environmental conditions for
the operator and reduces risks of contamination. This concept has been
developed and refined for maximum precision when grinding metal, silicon
and other semiconductor materials in small batch production, research
and development.
Application
The major application is the grinding of silicon and GaAs
in the 50mm up to 150 mm range.
Features
Fully enclosed grinding area
Diamond grinding wheels
PLC- Control
Measuring Unit
Minimal TTV’s
Automatic programs
Vacuum chucks
Consistent grinding results
Special Option
MPS R400 DS + TWIN-SPINDLE
The TWIN-SPINDLE concept shows several opportunities:
Two grinding wheels on one spindle
Roughing and finishing in one setting
High stock removal at fines finishes
Unbeatable work piece geometry
No wheel change between roughing and fine finishing
No secondary or rechecking of work piece for fine finishing
Shortest change-over times
JSP Technology, Inc.