One machine for grinding and polishing
Characteristics
The MPS R400 line of machines have been designed to take advantage
of state-of-the art grinding technologies and ergonomics. The fully
encapsulated grinding area offers optimum environmental conditions
for operator and reduces risks of contamination.
This new version is equipped with a grinding and a polishing spindle.
Application
Grinding and polishing semiconductor material in one process.
Features
Fully enclosed grinding area
TWIN SPINDLE with diamond grinding wheels
Automatic change grinding / polishing
Temperature control during polishing process
PLC - Control
Measuring unit
Automatic programs
Vacuum chucks
minimal TTV’s
Consistent grinding results
Special Option
MPS R400 DS + TWIN-SPINDLE
The TWIN-SPINDLE concept shows several opportunities:
Two grinding wheels on one spindle
Roughing and finishing in one setting
High stock removal at fines finishes
Unbeatable work piece geometry
No wheel change between roughing and fine finishing
No secondary or rechecking of work piece for fine finishing
Shortest change-over times
JSP Technology, Inc.