Fully Automatic Wafer Grinder G&N MULTI-NANO/3-300

General

The new G&N MULTI-NANO/3-300 is a highly efficient and fully automated machine
with Cassette to Cassette operation for grinding wafers up to 300 mm diameter.
It shares many design features with the proven NANOGRINDER. It is also equipped
with two grinding spindles and an air-bearing rotary table which contains three
rotating chuck stations. But while the MULTI-NANO/3-300 weight and dimensions are
unchanged the cost effectiveness has been considerable increased.

Spindles

G&N Machines are always equipped with application designed grinding spindles.

lifetime ( maintenance free ) grease
lubricated spindles ( 4000 rpm )

air bearing spindles for highspeed
grinding ( up to 6000 rpm )

magnetic bearing spindles ( 8000 rpm )

TWIN-SPINDLE Versions for increased
flexibility and tighter tolerances

By using the TWIN-SPINDLE technology, rough and finish grinding as well as loading and unloading are handled simultaneously,
which guarantees high throughput. Each spindle is mounted on an independent vertical slide assembly. The high-resolution
measuring system allows downfeed steps to a minimum of 0.1 µm.
All feed parameters ( roughing, finishing, sparkout, return and direction ) are freely programmable.
Moreover, with this machine, extreme low final thickness can be reached.
The machine is designed using state-of-the-art modular systems, enabling the MULTI-NANO/3-300 to be integrated into a fully
automatic wafer lab.

In-Process Thickness Gauging

In-process thickness gauging is utilized to measure wafer thickness during
grinding by using contact probes. Since the control always knows the actual
wafer thickness and wheel position, it can stop the infeed, when the
required wafer thickness is reached. In this way, the optimum in thickness
accuracy can be achieved. Thus thermal influences and tool wear have no
significant effects. This also allows, at the beginning of the grinding
operation, the wheel to move very closely to the wafer surface with rapid
speed, becausethe wafer preground thickness is measured.

Rotary Table

The air bearing CNC rotary table transports the wafer between roughing,
finishing and loading / unloading stations. The three rotary chucks
are built into the table. Each vacuum chuck ( all ceramic chucks ) is
mounted on a high precision spindle.

G&N Spindle Alignment

Wafer Handling System

The basic configuration for wafer handling has four cassette stations
( 2 loading / 2 unloading ) and two high speed robots with a centering
station and a wafer cleaning station.
The handling is designed for working in clean rooms.
The modular open ended handling design enables the integration of additional
transporting, cleaning and measuring steps in the process cycle and the
flexibility to adapt to prevailing space conditions.

Strategy Produces Best Possible TTV's
The G&N Spindle Alignment Strategy is based on the
fact that the geometry of a ground wafer can be
quantified relative to the alignment of the grinding
spindle axes. After the grinding process, the thickness
variation of the wafer can be measured with a special
measuring unit.
Then through a simulation process, the measured data is
compared to the previous spindle alignment settings and
correction values are calculated, as required.
With the specially designed spindle alignment adjusting
mechanism, the spindle positions are then corrected.
Optimum TTV values can be expected when grinding
the next wafer.

Machine Control

The machine is controlled by a SIEMENS PLC. The user
interface is a high performance, fully graphical Windows NT
program, which is specially user friendly developed
( menu guided ). The graphic display is a 14 inch TFT touch
screen with 800 x 600 dot resolution.

wafer

Technical Data’s

related Models

NanoGrinder/4

Brochure MultiNano 3/300 engl. (*.pdf)

MultiNano 3/300

JSP Pyramid Rotation_Blue

JSP Technology, Inc.