Safe and Easy Grinding Semiconductor Material

General

This high precision surface is a further development of the well-known
MPS2 R300-series.

Characteristics

Fully automatic vertical high precision surface grinder
with rotary table and vacuum chucks.

Applications

Rough and finish grinding of silicon, GaAs, sapphire
and other semiconductor materials at highest flatness
accuracy.

Features

Fully enclosed grinding area for optimal working comfort
and security – no contamination.
Automatic down feed system by four phase stepping motor,
infinitely variable down feed speed.
Gauging unit (optional devices) enables compensation of
wheel war and thermal effects – minimal thickness variation
values.

wafer

Technical Data’s

Models

MPS2 R300S

Brochure MPS2 R300 DCS german/engl. (*.pdf)

MPS2 R300 DCS

JSP Pyramid Rotation_Blue

JSP Technology, Inc.