Safe and Easy Grinding Semiconductor Material
General
This high precision surface is a further development of the well-known
MPS2 R300-series.
Characteristics
Fully automatic vertical high precision surface grinder
with rotary table and vacuum chucks.
Applications
Rough and finish grinding of silicon, GaAs, sapphire
and other semiconductor materials at highest flatness
accuracy.
Features
Fully enclosed grinding area for optimal working comfort
and security – no contamination.
Automatic down feed system by four phase stepping motor,
infinitely variable down feed speed.
Gauging unit (optional devices) enables compensation of
wheel war and thermal effects – minimal thickness variation
values.
Models
JSP Technology, Inc.