Ideal for the high demands of grinding electronic materials
General
This adaption of the MPS 2 R300 is equipped with automatic fine feed
to the grinding head, final size control and vacuum clamping.
Characteristics
Precision surface grinding machine with automatic grinding cycles,
in-process gage and vacuum chucking system.
Application areas
Batch production, research and development departments, where materials
such as silicon, gallium arsenide, germanium, indium phosphate, aluminum
oxide, piezo ceramic, quartz, ferrite, etc. have to be ground with
micron precision.
Optimum use
One-sided or back grinding of silicon and GaAs wafers
up to 150 mm in diameter.
Accessories
vacuum chucks
diamond grinding wheels
coolants
protective foils for sensitive front side surfaces
Models
JSP Technology, Inc.