For Semiconductor production and other advanced materials

Characteristics

With its polymer concrete casting for better vibration absorption
the machine is specially designed to improve the structural integrity,
rigidity and stiffness to grind advanced materials such like
silicon carbide and sapphire.

The operator can retrieve data and communicate directly with the
program supported by a 15" TFT touch screen and an industrial
computer. A diagnostic link can be installed to connect the customer
to our service center.

Modular Design - Future Upgrading

The V400 can be transformed from a single to a dual
spindle machine for fast stock removal and ultra-fine
surface finish.

Accessories

vacuum chucks

diamond grinding wheels

State-of-the-Art Machine Control

JSP Technology, Inc.